The Global Radiation Hardened Electronics (RHE) market size was USD 1.48 billion in 2021 and is expected to register a revenue CAGR of 3.9% during the forecast period, according to the latest analysis by Emergen Research. Rising demand for low-cost nanosatellites and communication satellites and increasing intelligence, surveillance, and reconnaissance operations due to growing hostility among nations are factors driving market revenue growth between 2022 and 2030.
The research segments the market based on product type, applications and end-use. It profiles the key players of the business and their individual contribution to the global economy. The report focuses on significant investments, business ventures, mergers, acquisitions, collaborations along with the technological developments in the field. It also evaluates the upcoming and niche areas in the business. The researcher aims to offer expert insights related to the industry and the new opportunities available in the market.
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The report projects the market is anticipated to grow at a significant rate owing to raid advancements and technological developments in the sector. The report offers strategic recommendations to the businesses and investors to capitalize on the lucrative growth opportunities. The report further provides a comprehensive analysis of the competitive landscape and provides complete coverage with regard to company profiles, product portfolio, revenue generation, financial standing, and market position. It also covers mergers and acquisitions, joint ventures, product launches, brand promotions, collaborations, agreements, and partnerships, among others. It also offers insights into the manufacturing processes, revenue estimations, RD advancements, and industrial penetration.
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Top Companies Operating in the Radiation Hardened Electronics Market and Profiled in the Report are:
Micropac Industries Inc., BAE Systems Plc., Honeywell International Inc., ST Microelectronics N.V., Microchip Technology Inc., Solitron Devices Inc., Cobham Limited, pSemi Corporation, Infineon Technologies AG, and Renesas Electronics Corporation.
Emergen Research has segmented the global radiation hardened electronics market based on manufacturing technique, product type, component type, application, and region:
- Manufacturing Technique Outlook (Revenue, USD Billion; 2019-2030)
- Rad-hard By Process
- Rad-hard By Design
- Rad-hard By Software
- Product Type Outlook (Revenue, USD Billion; 2019-2030)
- Commercial-off-the-shelf (COTS)
- Custom Made
- Component Type Outlook (Revenue, USD Billion; 2019-2030)
- Controllers Processors
- Analog Digital Mixed Signal Devices
- Memory
- Power management
- Application Outlook (Revenue, USD Billion; 2019-2030)
- Aerospace Defense
- Nuclear Power Plant
- Space
- Others
Radiation Hardened Electronics Market Segmentation by Regions:
- North America (U.S., Canada)
- Europe (U.K., Italy, Germany, France, Rest of EU)
- Asia Pacific (India, Japan, China, South Korea, Australia, Rest of APAC)
- Latin America (Chile, Brazil, Argentina, Rest of Latin America)
- Middle East Africa (Saudi Arabia, U.A.E., South Africa, Rest of MEA)
Objectives of the Report:
- Study of the global Radiation Hardened Electronics market size by key regions, types, and applications with reference to historical data (2017-2018) and forecast (2020-2027)
- Industrial structure analysis of the Radiation Hardened Electronics market by identification of various sub-segments
- Extensive analysis of key market players along with their SWOT analysis
- Competitive landscape benchmarking
- Analysis of Radiation Hardened Electronics market based on growth trends, futuristic outlook, and contribution to the total growth of the market
- Analysis of drivers, constraints, opportunities, challenges, and risks in the global Radiation Hardened Electronics market
- Comprehensive analysis of competitive developments such as expansions, agreements, new product launches, and other strategic alliances
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