Wafer Fabrication is a process which comprises of several recurring subsequent techniques to produce photonic circuits or electrical on semiconductor wafers. Some of the examples include LEDs, radio frequency (RF), optical computer parts, and CPUs. Wafer fabrication is used to build parts with substantial electrical design. The traditional wafer fabrication technique involves individual steps for conductors, transistors, resistors, and other electronic parts processing on the semiconductor wafer. The semiconductor device plays an important role in integrated circuit (IC) production, situated in a fab, a production facility. Hence, semiconductor wafer fabrication is utilized to build circuits, which are utilized in electronic and electrical equipment.
The fabrication process is carried out in a clean room and involves a series of steps and the technique may take from 10 to 30 days to achieve completion. Below mentioned are the steps involved in the fabrication process.
- Thermal oxidation or deposition
- Masking
- Etching
- Doping
- Dielectric deposition and metallization
- Passivation
- Electrical test
- Assembly
Get a FREE sample @https://www.marketresearchfuture.com/sample_request/8401
What is fab?
A fab is a commonly used teem where these processes are carried out and accomplished. Frequently the fab is acquired by the organization that sells the chips, such as Intel, AMD, Freescale, Texas Instruments. A foundry is a fab at which semiconductor chips or wafers are fabricated to order for third party companies that sell the chip, such as fab acquired by United Microelectronics Corporation (UMC), Taiwan Semiconductor Manufacturing Company (TSMC), Semiconductor Manufacturing International Corporation (SMIC) and Global Foundries.
Global Wafer Fabrication Market
The Global Wafer Fabrication Market is estimated to grow from USD 50.56 billion in 2018 to USD 62 Billion by 2025 growing at a CAGR of 4% in the forthcoming period. The technique to generate electronic integrated circuits (IC) is difficult. The device utilized for wafer fabrication comprises epitaxial deposition device, ion implantation device, diffusion systems oxidation systems, among others. Silicon is the most common semiconductor utilized for the wafer fabrication process. Rising demand for electronic and electrical equipment and the rise of the automotive sector is the most important factor driving the expansion of the wafer fabrication market 2020.
Some of the renowned names in the field of wafer fabrication are SCREEN Semiconductor Solutions Co., Ltd (Japan), Lam Research Corporation (US), SAMSUNG (South Korea), Tokyo Electron Limited (Japan), Hitachi High-Technologies Corporation (Japan), Applied Materials, Inc. (US), Intel Corporation (US), Motorola Solutions, Inc (US), ASML Holding NV (Netherlands) and KLA-Tencor Corporation (US).
It has been anticipated that the global wafer fabrication market will grow at a significant speed in the forthcoming period. The process of producing electronic integrated circuits (IC) is complex. The equipment used for wafer fabrication includes epitaxial deposition equipment, oxidation systems, diffusion systems, ion implantation equipment among others. Silicon is the most common semiconductor used for the wafer fabrication process. Increasing demand for electronic and electrical devices and the growth of the automotive industry are the major factors contributing to the growth of the global wafer fabrication market.
Get a FULL report @https://www.marketresearchfuture.com/reports/wafer-fabrication-market-8401
Here are some of the important facts about wafer fabrication
- The semiconductor wafer comprises silicon. Silicon is the second-most common element present on the Earth
- It is mandated to provide proper storage condition to avoid contamination or degradation after shipment
- Wafers need particular sand. Most of the sand utilized to produce a wafer is transported from beaches in Australia.
- The first semiconductor wafer was manufactured in the US in 1960 which was 1 inch in diameter.
- Wafers are produced with a very pure crystal material.
- In 2013 the cost of building the next generation wafer fab was over $10 billion.
Geographically, North America is the fastest expanding market due to the presence of technologically advanced companies. However, the APAC region seems to take over the race with China and Japan being the most important contributors. These countries endorse the usage of IoT, AI and connected devices across several verticals of the industry. Rising demand for electronic and electrical equipment are the most crucial factors contributing to the expansion of the market. The market is likely to increase at a decent pace with the participation of the key players in the market.
